Huawei Technologies has engineered a workaround to one of China’s most crippling chipmaking bottlenecks, but analysts warn that the nation’s path to semiconductor independence is still constrained by manufacturing challenges. The US-sanctioned tech giant on Monday introduced a new scaling law and a chip architecture designed to deliver products equivalent to an advanced 1.4-nanometre processing node by 2031. If true, the innovation marks a significant milestone for Huawei, which has been cut off...