Chinese tech giant Huawei Technologies said it had found a way to make semiconductors on a par with the best worldwide without having to use cutting-edge chipmaking equipment it is unable to access due to US sanctions. The breakthrough will allow Huawei to make high-end chips that are equivalent to 1.4 nanometres by 2031, He Tingbo, president of the companyโs semiconductor business, told a tech conference in Shanghai on Monday. TSMC, the worldโs biggest producer of advanced semiconductors, plans...
When He Tingbo took the stage in Shanghai this week to unveil Huawei Technologiesโ Tau (ฯ) Scaling Law, the message was about more than a new chip development framework. It was also a statement, showing how the most prominent Chinese technology company to have been subjected to US sanctions wants to compete in semiconductors when access to the worldโs most advanced chipmaking tools remains restricted, and when the industryโs decades-old reliance on shrinking transistors is becoming more...