Chinese tech giant Huawei Technologies said it had found a way to make semiconductors on a par with the best worldwide without having to use cutting-edge chipmaking equipment it is unable to access due to US sanctions. The breakthrough will allow Huawei to make high-end chips that are equivalent to 1.4 nanometres by 2031, He Tingbo, president of the company’s semiconductor business, told a tech conference in Shanghai on Monday. TSMC, the world’s biggest producer of advanced semiconductors, plans...